Silicon Photonics Chiplet Package - Optical Assembly and Integration Technologies

Explore a 34-minute technical presentation examining packaging technologies for silicon photonics chiplets, with particular emphasis on in-package optical components and assembly processes. Learn about the crucial role of in-package optical I/O chiplets in future high-performance computing, highlighting their advantages in bandwidth, energy efficiency, latency, and reach capabilities. Dive into the packaging process flow of TeraPHY™ optical I/O chiplet and understand the electrical and optical architecture of silicon photonics package modules. Examine the current state of the optical assembly ecosystem, including its challenges and development needs. Investigate various options for first-level optical interfaces on silicon photonics chips, and understand the specific requirements for optical fiber, adhesive, and assembly equipment. Gain insights into the necessity of 2nd level optical interfaces and the importance of establishing new industry standards in this emerging field.