Watch a 17-minute conference talk exploring how SCINTIL Photonics addresses the exponential growth of AI computing demands through advanced optical interconnect solutions. Learn about heterogeneous integration of III-V materials with silicon photonics to create photonic integrated circuits (PICs) featuring monolithically integrated DFB lasers and SOA. Discover how this innovative technology enables higher data throughput and lower power consumption in data centers and HPC clusters through CWDM4 transmitters for Pluggable Optics and DWDM external laser sources for Co-Packaged Optics. Gain insights into how parallelism and optical interconnects are becoming crucial for meeting the escalating demands of AI/ML applications.
Augmented Silicon Photonics for Data Center and AI/ML Optical Interconnects
Open Compute Project via YouTube
Overview
Syllabus
Augmented Silicon Photonics for Data Center and AI/ML optical interconnects
Taught by
Open Compute Project
Related Courses
-
Optical Compute Interconnect: Co-Packaged Optics for AI and Computing Infrastructure
-
Coherent Optics and Photonics Technologies for AI Data Center Interconnects
-
Energy-Efficient High Bandwidth Optical Interconnect Solutions for Generative AI
-
Re-configurable Photonic Interconnects for AI/ML Infrastructure - Building DX Fabric for Data Centers
-
A Continuous-Wave On-Demand Si-Integrable Gain-Printed Nanolaser
-
The Next Wave of Computing with Optical I/O - Scaling AI and Cloud Computing Performance
