Optical Compute Interconnect: Co-Packaged Optics for AI and Computing Infrastructure

Learn about Intel's groundbreaking 4 Tbps Optical Compute Interconnect (OCI) chiplet technology in this technical presentation from the Open Compute Project. Explore how Silicon Photonics technology enables higher bandwidth density, energy efficiency, and low latency connectivity for AI acceleration and compute infrastructure. Discover the integration of Silicon Photonics Integrated Circuits (PIC) with embedded lasers and optical amplifiers, alongside the successful demonstration at OFC 2024 showing error-free link performance when co-packaged with Intel CPUs. Gain insights into Intel's mature Silicon Photonics platform, which has deployed over 8 million PICs containing more than 32 million on-chip lasers in data center connectivity applications, achieving industry-leading reliability standards.