MEPTEC Courses

The Role of Machine Learning in Electronic Design Automation

Explore how machine learning revolutionizes electronic design automation, enhancing semiconductor development and improving design efficiency through AI-driven solutions.

• YouTube
• 37 minutes
• On-Demand
• Free Video

AutoChip - Using Large Language Models to Automate IC Design

Discover how Large Language Models are revolutionizing integrated circuit design automation, enhancing efficiency and innovation in semiconductor development.

• YouTube
• 36 minutes
• On-Demand
• Free Video

Big Strides in Electronics Test and Production - From Algorithmic Methods to Unsupervised Machine Learning

Discover how algorithmic methods and unsupervised machine learning are revolutionizing electronics testing and production processes for enhanced efficiency and automation.

• YouTube
• 30 minutes
• On-Demand
• Free Video

Finding the Needle in the Haystack - On the Use of AI in Defect Analysis

Explore how artificial intelligence revolutionizes semiconductor defect analysis, enhancing detection accuracy and streamlining quality control processes in manufacturing.

• YouTube
• 38 minutes
• On-Demand
• Free Video

Implementing Real-time AI in High Volume Test

Discover practical strategies for implementing AI solutions in high-volume semiconductor testing environments, focusing on real-time applications and efficiency optimization.

• YouTube
• 32 minutes
• On-Demand
• Free Video

Infrastructure and Applications for AI in Semiconductor Test

Explore cutting-edge AI applications and infrastructure developments in semiconductor testing, focusing on optimization and efficiency improvements in manufacturing processes.

• YouTube
• 32 minutes
• On-Demand
• Free Video

Novel Techniques for IC Integration and Packaging Using Additive Technologies

Explore innovative Flexible Hybrid Electronics manufacturing techniques combining thinned dies, printed components, and flexible materials to revolutionize electronics packaging and system integration.

• YouTube
• 34 minutes
• On-Demand
• Free Video

Retrospective on MEMS Packaging - Challenges and Evolution from Industrial to Consumer Applications

Explore the evolution of MEMS packaging from 1960s pressure sensors to modern 3D-printed solutions, covering automotive, medical, and consumer applications while examining key technological advances.

• YouTube
• 35 minutes
• On-Demand
• Free Video

Packaging of Sensors for High Reliability, Survival and Performance in Extreme Environments

Explore sensor packaging design challenges for extreme aerospace environments, focusing on MEMS integration, material selection, and reliability testing for hypersonic applications.

• YouTube
• 35 minutes
• On-Demand
• Free Video

Solving Moore's Law Packaging Challenges Through Next-Generation Materials and 3D Integration

Explore advanced semiconductor packaging solutions addressing Moore's Law limitations through heterogeneous integration, 3D stacking, and innovative copper interconnect materials for enhanced performance and miniaturization.

• YouTube
• 36 minutes
• On-Demand
• Free Video

Challenges to Develop Reliable Lead Free Solder Columns for Large Heterogeneous Packages

Explore the development of lead-free braided solder columns as a reliable alternative to solder balls in large heterogeneous packages, focusing on enhanced stress relief and thermal performance.

• YouTube
• 21 minutes
• On-Demand
• Free Video

Enabling High Volume Data Communication - Solving Challenges in PIC Wafer Testing

Discover how Photonic Integrated Circuits revolutionize data communication through wafer testing innovations, focusing on Jenoptik's UFO Probe® card for simultaneous electrical and optical testing at high volumes.

• YouTube
• 35 minutes
• On-Demand
• Free Video

Silicon Photonics Chiplet Package - Optical Assembly and Integration Technologies

Explore cutting-edge packaging technologies for silicon photonics chiplets, focusing on optical components, assembly processes, and future high-performance computing applications.

• YouTube
• 34 minutes
• On-Demand
• Free Video

3D IC Test Strategy and DFT Methodologies for Advanced Packaging Technologies

Explore comprehensive testing strategies for 3D integrated circuits, covering DFT methodologies, BSDL implementation, and IJTAG integration for advanced semiconductor packaging technologies.

• YouTube
• 45 minutes
• On-Demand
• Free Video

Assembly Solutions for Cost Effective Heterogeneous Integration with Disparate Die Types

Explore semiconductor assembly optimization techniques for heterogeneous integration, focusing on efficient placement solutions and economic impacts across various packaging technologies.

• YouTube
• 34 minutes
• On-Demand
• Free Video