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Intro
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Classroom Contents
Solving Moore's Law Packaging Challenges Through Next-Generation Materials and 3D Integration
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- 1 Intro
- 2 Market Drivers Creating Demand for Next Generation Materials
- 3 SMT Bonding Examples
- 4 Performance & Application Process
- 5 Manufacturing & Scalability
- 6 ActiveCopper "aCu" Characteristics
- 7 Thermal performance
- 8 Thermal Resistance Case Study
- 9 Optical Measurements
- 10 Medium Size Die (6 x 5 mm) On Lead-Frame
- 11 Thermal Shock Testing (5x5 mm die)
- 12 Seamless CTE Adjustment
- 13 High Value Materials System
- 14 Kuprion Background
