Explore a 45-minute technical presentation from the Storage Developer Conference 2022 that delves into Universal Chiplet Interconnect Express (UCIe), an open industry standard revolutionizing semiconductor innovations. Learn how UCIe addresses the growing demands of cloud, edge, enterprise, 5G, and high-performance computing through package-level integration and chiplet ecosystem development. Discover the UCIe 1.0 specification's comprehensive stack enabling plug-and-play interoperability of chiplets, similar to established standards like PCI Express®, USB®, and CXL™. Master the key metrics, usage models, and technology solutions while understanding the various layers, software models, compliance mechanisms, and interoperability features. Gain valuable insights into UCIe's evolution and its potential for incorporating additional usage models, particularly in System-on-Chip (SoC) construction with multi-vendor chiplet components.
Universal Chiplet Interconnect Express (UCIe): Accelerating the Future of Semiconductor Innovations
Overview
Syllabus
SDC2022 – Universal Chiplet Express: Accelerating the future of semiconductor innovations
Taught by
SNIAVideo
Related Courses
-
SoC Construction Using Universal Chiplet Interconnect Express (UCIe) - A Game Changer
-
UCIe - Universal Chiplet Interconnect Express for Die-to-Die Integration
-
UCIe: An Open Standard for Package-Level Innovations in Computing Systems
-
Universal Chiplet Interconnect Express - Building an Open Ecosystem of Chiplets
-
Universal Chiplet Interconnect Express (UCIe) 2.0 Specification - Technology Overview and Updates
-
Big-Disk Computational Storage Array for High Performance Data Analytics
