Watch a keynote presentation from Intel Corp.'s Debendra Das Sharma exploring the Universal Chiplet Interconnect Express (UCIe) specification and its role in building an open chiplet ecosystem. Learn about the features of UCIe 1.0 that enable interconnection between chiplets within a package, allowing for the integration of dies from different sources, designs, and fabrication facilities. Discover how this open specification addresses growing computational demands across cloud, edge, enterprise, 5G, automotive, high-performance computing, and mobile segments. Gain insights into how UCIe technology facilitates the creation of customized System-on-Chip (SoC) solutions by enabling users to mix and match chiplet components from multiple vendors in the ecosystem.
Universal Chiplet Interconnect Express - Building an Open Ecosystem of Chiplets
OpenFabrics Alliance via YouTube
Overview
Syllabus
Keynote UCIe(TM) Building Open Ecosystem of Chiplets
Taught by
OpenFabrics Alliance
Related Courses
-
Universal Chiplet Interconnect Express (UCIe) 2.0 Specification - Technology Overview and Updates
-
Enabling an Open Chiplet Ecosystem with UCIe - Introduction to UCIe 1.1 Specification
-
Universal Chiplet Interconnect Express (UCIe): Accelerating the Future of Semiconductor Innovations
-
SoC Construction Using Universal Chiplet Interconnect Express (UCIe) - A Game Changer
-
UCIe: An Open Standard for Package-Level Innovations in Computing Systems
-
UCIe - Universal Chiplet Interconnect Express for Die-to-Die Integration
