Universal Chiplet Interconnect Express - Building an Open Ecosystem of Chiplets

Watch a keynote presentation from Intel Corp.'s Debendra Das Sharma exploring the Universal Chiplet Interconnect Express (UCIe) specification and its role in building an open chiplet ecosystem. Learn about the features of UCIe 1.0 that enable interconnection between chiplets within a package, allowing for the integration of dies from different sources, designs, and fabrication facilities. Discover how this open specification addresses growing computational demands across cloud, edge, enterprise, 5G, automotive, high-performance computing, and mobile segments. Gain insights into how UCIe technology facilitates the creation of customized System-on-Chip (SoC) solutions by enabling users to mix and match chiplet components from multiple vendors in the ecosystem.