Learn about the groundbreaking UCIe 1.0 specification in this 15-minute technical talk that explores how on-package integration of heterogeneous processing units meets the demands of modern computing. Discover how high-performance workloads in AI, ML, data analytics, 5G, automotive, and high-performance computing are driving the need for advanced on-package interconnects in cloud computing, intelligent edge, and client computing infrastructure. Gain insights into the complete standardized die-to-die interconnect system, including its physical layer, protocol stack, software model, and compliance testing, while understanding how it builds upon established PCI Express® and Compute Express Link™ industry standards to deliver power-efficient performance for next-generation computing solutions.
UCIe - Universal Chiplet Interconnect Express for Die-to-Die Integration
Open Compute Project via YouTube
Overview
Syllabus
UCIe™ (Universal Chiplet Interconnect Express™)
Taught by
Open Compute Project
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