Explore a comprehensive 51-minute conference talk from the Storage Developer Conference 2023 that delves into the revolutionary Universal Chiplet Interconnect Express (UCIe) and its impact on System-on-Chip construction. Discover how high-performance workloads in artificial intelligence, machine learning, data analytics, 5G, automotive, and high-performance computing are driving the need for on-package integration of heterogeneous processing units. Learn about UCIe's role as an open industry standard enabling plug-and-play interoperability of chiplets, similar to established standards like PCI Express®, USB®, and CXL®. Master the technical aspects of UCIe's layered architecture, software model, compliance mechanisms, and its potential for enabling co-packaged optics for server connectivity. Gain insights into why chiplets are becoming the preferred method for SoC construction across compute and storage segments, and understand how this open standard ecosystem leverages best practices from existing technologies while evolving to meet future computing demands. Presented by Intel's Debendra Das Sharma, this talk provides essential knowledge for professionals interested in next-generation computing architecture and interconnect technologies.
Overview
Syllabus
SDC 2023 - SoC Construction Using Universal Chiplet Interconnect Express (UCIe): A Game Changer
Taught by
SNIAVideo