Explore a technical presentation from SNIA Storage Developer Conference 2024 where Debendra Das Sharma, UCIe Consortium Chairman from Intel, delves into the Universal Chiplet Interconnect Express (UCIe) technology and its latest specifications. Gain insights into the open industry standard that enables high-bandwidth, low-latency, and cost-effective on-package connectivity between chiplets. Learn about the valuable improvements in UCIe 1.1 Specification, including enhanced reliability mechanisms, automotive industry adaptations, and cost-effective implementations. Discover how compliance and interoperability testing specifications are establishing a robust chiplet ecosystem. Master the current ecosystem dynamics, understand the technical features of UCIe 1.1 specification, and stay updated with the latest consortium developments in this 24-minute comprehensive overview of chiplet interconnect technology.
Universal Chiplet Interconnect Express (UCIe) 2.0 Specification - Technology Overview and Updates
Overview
Syllabus
SNIA SDC 2024 - UCIe 2_0 Specification
Taught by
SNIAVideo
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