How Chiplets Are Transforming the Semiconductor Ecosystem - From Design to Packaging
Open Compute Project via YouTube
Overview
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Learn about the transformative impact of chiplet technology on the semiconductor industry in this 15-minute presentation from Yole Group's Business Line Director, Emilie Jolivet. Explore how chiplet architecture has evolved over the past 5 years to meet the demands of power-efficient high-performance computing while maintaining cost-effectiveness. Discover the integration capabilities of specialized components like high-speed interconnects, memory, and accelerators that enhance system-level performance. Examine how the rise of generative AI and 2.5D/3D architectures has accelerated chiplet adoption by addressing technical challenges. Understand the evolution beyond traditional CPU/GPU and HBM memory integration through silicon interposers, focusing on the benefits of flexibility, modularity, and design reusability. Follow the journey of chiplet implementation in datacenter and consumer markets, and gain insights into its projected widespread adoption and future implications for the semiconductor ecosystem.
Syllabus
Why chiplet will transform the semiconductor ecosystem from design to packaging?
Taught by
Open Compute Project