Heterogeneous Integration and Chiplet Manufacturing in the US - A Technical Overview

Learn about the evolving landscape of chiplet technology and advanced packaging manufacturing in the United States through two comprehensive talks. Explore how chiplet technology enables faster and more cost-effective production of complex integrated circuits by breaking them into smaller, manageable components. Discover the role of the US Chips Act in incentivizing chiplet technology development and advanced packaging, while understanding the challenges in developing viable high-volume US-based IC manufacturing. Examine the efforts of industry alliances like OCP/ODSA in creating an open chiplet ecosystem, including standardization of interconnects, business workflows, and modeling. Delve into technical aspects of chiplet assembly, including substrate configurations, joining methods, tool sets, and testing procedures, with a focus on US manufacturing capabilities and pilot line requirements. Gain insights into the formation of new alliances like Chiplet.us and their role in establishing a collaborative ecosystem for chiplet-based design and manufacturing in the United States.