Solving Moore's Law Packaging Challenges Through Next-Generation Materials and 3D Integration

Learn about the evolution of semiconductor packaging technology in this 36-minute technical presentation that addresses critical challenges in maintaining Moore's Law progression. Explore how the electronics industry is shifting from traditional CMOS scaling to advanced packaging solutions through heterogeneous integration and 3D stacking. Discover Kuprion Inc.'s innovative ActiveCopper™ system as an alternative to traditional solders, offering superior electrical and thermal conductivity for modern interconnect requirements. Examine detailed performance comparisons, including a 20-25% improvement over AuSn solder in LED bonding applications, while understanding the material's characteristics, thermal properties, and manufacturing scalability. Gain insights into practical applications through case studies, thermal resistance analysis, and optical measurements, with specific focus on die-on-lead-frame implementations and thermal shock testing results.