Rear Door Heat Exchanger Interfaces for Open Rack V3 - Design Challenges and Integration

Explore the mechanical, maintenance, and thermodynamic interface challenges between ORV3 racks and Rear Door Heat Exchangers (RDHx) in this 13-minute technical presentation from Rittal North America's Head of Advance Development of Cooling Technology. Learn about multiple system configurations including traditional RDHx setups, Direct Liquid Cooling (DLC) implementations, pumping units with air-assisted heat exchangers, and in-rack CDU solutions. Examine critical specifications for system power requirements, data center compatibility, door parameters, manifold positioning, fluid connection layouts both in-rack and between components, DC busbar connectivity, and communications interface requirements.