Learn about groundbreaking advancements in busbar technology through this technical presentation from Te Connectivity and Meta experts. Explore how liquid cooling integration into busbars can dramatically increase power capacity by 2-4x compared to traditional air-cooled solutions, specifically designed to meet the escalating power demands of AI workloads. Discover the innovative vertical busbar design proposal that leverages existing liquid cooling rack infrastructure to support next-generation 200kW+ OCP AI platforms without increasing the physical footprint. Gain insights from industry leaders Hal Loket, Dmitriy Shapiro, and Lily Zhang as they address the critical power constraints facing the AI industry and present practical solutions for scaling rack power levels.
Overview
Syllabus
Beyond ORv3 HPR Rack Vertical Busbar Next Gen Rack Busbar Enabling 200kW AI racks
Taught by
Open Compute Project
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