Learn about signal integrity analysis challenges and solutions in the era of silicon interposers through this 34-minute technical presentation from MEPTEC. Explore how high-performance computing, AI processors, and CPU/GPU advancements drive the need for 2.5D/3D IC technology and advanced packaging approaches. Discover why traditional design methodologies must evolve to meet aggressive performance goals through co-simulation of die, interposer, package, and PCB components. Examine the unique challenges posed by silicon interposers, including silicon density, high speeds, through-silicon vias, and long-distance signaling. Understand the importance of early collaboration between design teams and how Ansys' multiphysics solutions, advanced workflows, and electromagnetic solvers address complex SI issues in silicon interposer architecture. Follow detailed technical discussions covering IC market trends, heterogeneous design approaches, RaptorH capabilities, analytical modeling, case studies, and system optimization techniques for successful 2.5D/3D-IC product development.
Signal Integrity Analysis for 2.5D/3D IC Technology in the Interposer Era
Overview
Syllabus
Intro
IC Market Megatrends...
Heterogeneous Design with Silicon Interposers
3D-IC Engineering Challenges
SI Challenges for High-Speed Silicon Interposer 2.5D/3D-ICS
RaptorH: The Die-centric Approach to 2.5D/3D-IC SI Analysis
RaptorH certification by foundries seals golden reference status
Analytical modeling of iCAPS (Interposer CAPacitors)
Case study: HBM channel with dense dummy tiles
RaptorX vs HFSS: Transmission & Reflection of Net04 and Net12
RaptorX vs HFSS: Coupling of Net04 and Net12
Circuit simulation results at termination
Key Capability: Gold Standard Accuracy, Reliability
Interposer Design
HFSS simulation
Ansys optiSLang: Power of Variation Analysis
HFSS 3D Layout Parametric Design
Interposer on Package on PCB Optimization
Interposer on Package on PCB System results
Taught by
MEPTEC
