Retrospective on MEMS Packaging - Challenges and Evolution from Industrial to Consumer Applications

Watch a comprehensive 35-minute conference talk exploring the historical development and evolution of MEMS (Micro-Electro-Mechanical Systems) packaging technology. Trace the journey from early 1960s pressure sensors utilizing metal TO cans and custom industrial sensors through to the 1980s-1990s emergence of plastic automotive packaging for pressure, flow, acceleration sensors, and gyroscopes. Examine the expansion into medical and consumer applications, including blood pressure devices, biocompatible implants, smartphones, gaming systems, and wearable technology. Learn about wafer level packaging techniques, MEMS chip scale packaging (CSP), hermetic bonding, and CVD sealing technology. Discover how modern 3D printing and additive manufacturing methods are revolutionizing sensor assembly, prototyping, and packaging across plastic, glass, and metal materials.