Packaging of Sensors for High Reliability, Survival and Performance in Extreme Environments

Learn about the intricate challenges and solutions in designing sensor packaging for extreme aerospace environments in this technical talk. Explore the complexities of integrating MEMS-based sensors into packaging systems that must withstand harsh conditions like high temperatures, oxidation, and extreme pressures. Discover key considerations in material selection, geometric design, and electrical interconnect integrity while maintaining optimal sensor performance. Through case studies focused on hypersonic aero-propulsion environments, examine analysis methods, experimental data, and valuable lessons learned in the development and testing of robust sensor packaging solutions. Gain insights into managing thermal and pressure gradients, specialized testing facilities, and strategies for ensuring long-term reliability in both civilian and military aerospace applications.