Novel Techniques for IC Integration and Packaging Using Additive Technologies

Explore a 34-minute technical presentation that delves into the innovative world of Flexible Hybrid Electronics (FHE) and its revolutionary impact on IC integration and packaging. Learn how NextFlex combines diverse manufacturing processes including conventional electronics, printing, plastics processing, additive manufacturing, laser imaging, and robotic assembly to create flexible, conformal electronics with thinned dies and printed components. Discover how additive processes blur the lines between advanced packaging and circuit boards, enabling integration of wiring and antennae directly into structural components. Examine real-world applications and projects that showcase flip chip attachment of thinned bare die microcontrollers on non-traditional substrates, integration of unpackaged MEMs devices, and innovative techniques replacing traditional wire bonds for direct IC integration on PCB. Gain insights into how this technology convergence is revolutionizing electronics integration at the system level and advancing US manufacturing innovation in electronics packaging.