Enabling High Volume Data Communication - Solving Challenges in PIC Wafer Testing

Watch a 35-minute technical presentation exploring the advancements in Photonic Integrated Circuit (PIC) wafer testing for high-volume data communication applications. Learn how PICs are revolutionizing various fields including data transceivers, gene sequencing, blood analysis, and LiDAR by enabling power efficiency, increased bandwidth, and miniaturization of photonic devices. Discover the manufacturing process similarities between PICs and traditional electronic components, while understanding the unique challenges in wafer testing due to optical component integration. Explore Jenoptik's UFO Probe® card solution that enables simultaneous electrical and optical testing of chips on wafers, integrating seamlessly with existing test infrastructure and eliminating the need for standalone solutions. Understand how this technology enhances production efficiency by providing early performance feedback at the wafer level, ultimately leading to higher yields in high-volume manufacturing environments.