Challenges to Develop Reliable Lead Free Solder Columns for Large Heterogeneous Packages

Learn about the development of reliable lead-free solder column technology in this 21-minute technical presentation that addresses critical challenges in large heterogeneous package manufacturing. Explore how solder columns can replace traditional solder balls in super-sized BGA processors exceeding 60mm square, particularly for hyperscale data centers. Discover innovative solutions using copper braided sleeve exoskeletons to create RoHS-compliant interconnects that provide superior stress relief and improved thermal performance. Examine the evolution from 40-year-old tin-lead technology to modern lead-free alternatives, with detailed insights into design considerations, engineering samples, and comparative analysis between solder columns and balls. Gain valuable understanding of market trends, technical requirements, and initial characterization data for this next-generation interconnect technology that promises to enhance reliability in large-scale chip packaging applications.