Introduction to the Dual Small Form Factor (DSFF) for OCP NIC 3.0

Learn about the evolution and capabilities of the Dual Small Form-Factor (DSFF) in OCP NIC specifications through this technical presentation by experts from Intel and Dell Technologies. Explore how DSFF enables DC-MHS compatible servers to utilize either one DSFF or two SFF OCP NIC cards, providing flexibility for both Foundational NIC and SmartNIC deployments across AI, Cloud, and Telecom/Edge market segments. Discover the advancements built upon the widely accepted OCP NIC 3.0 SFF, including doubled board area, native support for 32 lanes of PCIe Gen6, and enhanced power delivery up to 160W. Gain insights into the electrical and mechanical updates that make this technology advancement possible.