OCP NIC 3.0 PCIe Gen 6 Support with Next Generation SI and Thermal Test Fixtures

Learn about PCIe Gen 6 support enhancements for OCPNIC 3.0 specification in this technical talk presented by experts from Dell Technologies and Broadcom. Explore key aspects including bi-furcation, manageability modes, insertion loss budget, test integration, and test fixtures. Discover current SI test and thermal test fixtures available for SFF/TSFF and LFF thermal testing supporting host interface speeds up to 32 GT/s (PCIe Gen 5). Examine plans for next-generation SI fixtures designed to support PCIe Gen 6 (64 GT/s) speeds for SFF/TSFF and DSFF, following proposed PCI SIG fixture approaches. Understand the development of next-generation thermal test fixtures optimized for both hot-aisle and cold-aisle operation, featuring DC-MHS HBM connectivity for enhanced speed and testing flexibility.