Microelectronics enable all aspects of our daily lives (across consumer products, automotive, communication, computer, medical, agriculture), and must all be housed in secure packages. This specialization, jointly developed by ASU and Intel, provides a foundational understanding of what Semiconductor Packaging is, how packaging is designed and made, and how it works to finish, connect and protect functional parts.
Overview
Syllabus
Course 1: Introduction to Semiconductor Packaging
- Offered by Arizona State University. This course will cover various aspects of microelectronics and nanoelectronics. This field aims to ... Enroll for free.
Course 2: Semiconductor Packaging Manufacturing
- Offered by Arizona State University. This course will provide information on the various stages of semiconductor package manufacturing, ... Enroll for free.
Course 3: Advanced Semiconductor Packaging
- Offered by Arizona State University. Throughout this course, you will be introduced to Pathway for Assembly and Packaging technologies for ... Enroll for free.
- Offered by Arizona State University. This course will cover various aspects of microelectronics and nanoelectronics. This field aims to ... Enroll for free.
Course 2: Semiconductor Packaging Manufacturing
- Offered by Arizona State University. This course will provide information on the various stages of semiconductor package manufacturing, ... Enroll for free.
Course 3: Advanced Semiconductor Packaging
- Offered by Arizona State University. Throughout this course, you will be introduced to Pathway for Assembly and Packaging technologies for ... Enroll for free.
Courses
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This course will provide information on the various stages of semiconductor package manufacturing, including sort, assembly, and final test. In addition, we will also describe how to select, build, and test the packages with the die and other components to ensure the quality of the package and total assembly performance. We will also discuss the role of Process Control Systems in semiconductor manufacturing as they relate to quality testing. Specifically, we will explore how Process Control Systems can help identify and correct process problems that cause variation and quality issues. Finally, we also demonstrate how to use control charts to monitor the process performance. These can assist in decision-making, specifically when to take action to improve the process.
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Throughout this course, you will be introduced to Pathway for Assembly and Packaging technologies for 7-nanometer silicon feature sizes and beyond. The course will present the evolution and impact of packaging on product performance and innovation. Specifically, we highlight how packaging has enabled better products via the use of heterogeneous integration by improving the interconnects for thermal management and signal integrity.
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This course will cover various aspects of microelectronics and nanoelectronics. This field aims to advance and improve the functionality of electronic devices by scaling transistors to smaller feature sizes. The course will introduce you to essential concepts such as length scales, transistor actions, and feature sizes of integrated circuits. The course will also look at historical observations and trends using Moore’s Law, which currently guides and predict development of the Semiconductor industry. Most importantly, our goal is to highlight why packaging is so important and relevant today. Furthermore, we will also explore the anatomy and function of a semiconductor package, starting with substrate-level package interconnection to the motherboard. We will also describe features as we differentiate various types of packages and how they differ in materials, design, and reliability.
Taught by
Terry Alford
