Overview
Syllabus
What is this video about
Raw material cut to panels
Cleaning PCB
Photosensitive film applied Building layers L2 & L3
Exposing L2, L3
Developing L2, L3
Etching L2, L3
Removing photosensitive layer
AOI - Automated Optical Inspection
Making copper rougher
Adding prepreg
Adding copper sheets - Top and Bottom layer L1, L4
Baking PCBs, oven room
Splitting to two panels again
Adding aluminum sheet
Drilling
Plating
Electroless plating
Electroplating
Applying photosensitive film on L1 and L4
Exposing L1, L4
Developing L1, L4
Applying tin layer
Removing photosensitive layer from L1, L4
Etching L21 L4
Removing tin layer
AOI - Automated Optical Inspection
Optional electrical testing
Adding solder mask color
Exposing solder mask
Developing solder mask
Making silkscreen
Gold plating
Optical inspection, fixing, measuring
Electrical test
Milling - Removing PCB from big panel
V-Score
Packing PCB
Board Assembly
Inserting components into feeders
Stencil & Paste
Setting up component placement
Checking placement with AOI
Soldering - Going to owen
Checking after soldering
Assembling a board
Manual checking
Fitting through hole components
Wave soldering
Conformal coating
Packing assembled board
3D printing
Done. Packing and shipping
Taught by
Robert Feranec