Explore hardware reverse engineering techniques in this 54-minute conference talk from BSidesLV 2014. Delve into PCB construction and layer stack analysis, learn about laser-based methods for soldermask removal, controlled-depth skiving, and full PCB layer ablation. Discover the applications of acoustic microscopy in examining epoxy encapsulation, and gain insights into X-ray inspection techniques, including both 2D general PCB inspection and 3D/CT PCB layer extraction. Enhance your understanding of advanced hardware analysis methods and their practical applications in reverse engineering.
Overview
Syllabus
Using Superpowers for Hardware Reverse Engineering
HW Reverse Engineering
PCB Construction & Layer Stack 2
Laser: Soldermask Removal 2
Laser: Controlled-Depth Skiving 2
Laser: Full PCB Layer Ablation 2
Acoustic Microscopy: Examining Epoxy Encapsulation
X-Ray (2D): General PCB Inspection 4
X-Ray (3D/CT): PCB Layer Extraction
