Learn about cutting-edge developments in packaging and assembly techniques essential for bringing neuromorphic photonic integrated circuits (PICs) to market in this 31-minute research presentation from the Instituto de Física Interdisciplinar y Sistemas Complejos (IFISC). Explore the technical challenges and innovative solutions in the commercialization process of neuromorphic PICs, focusing on advanced packaging methodologies and assembly techniques that bridge the gap between laboratory prototypes and commercially viable products.
Packaging and Assembly Advancements for Commercialization of Neuromorphic PIC
Instituto de Física Interdisciplinar y Sistemas Complejos (IFISC) via YouTube
Overview
Syllabus
Packaging and assembly advancements for commercialization of neuromophic PIC
Taught by
Instituto de Física Interdisciplinar y Sistemas Complejos (IFISC)
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