DC-SCM 2.1 LTPI Specification - Learnings, Challenges and Future Direction

Watch a technical presentation from Intel, Lattice Semiconductor, and AMD engineers exploring the LTPI (LVDS-based Tunneling Protocol and Interface) Specification within DC-SCM 2.x specifications. Dive into key improvements and changes introduced in DC-SCM Rev 2.1 LTPI Rev 1.1, examining real-world implementation challenges and validation experiences at scale. Learn about critical considerations including reliability challenges around Data Link Layer implementation, I2C/SMBus event handling and multi-initiator support, advanced features like multi-data-lane LTPI with clock recovery, and the development of interoperability and compliance testing frameworks. Gain valuable insights from industry experts about the future direction of LTPI specifications and ongoing development work within the DC-SCM Working Group.