Learn how to create an effective board support package (BSP) for Yocto Project in this comprehensive 58-minute conference talk by Chris Simmonds at NDC Conferences. Explore the importance of BSP layers as the foundation for other meta layers, and gain step-by-step guidance on building support for your specific board. Discover key concepts such as SoC configuration, storage technologies, and GPIO mapping. Delve into topics including meta layers, environment setup, local configuration, recipes, and the trinity of OpenEmbedded: Distro, Machine, and Image. Master the creation of BSP layers, bootloader configuration, kernel setup, and image formatting. Learn best practices for avoiding common pitfalls and maintaining simplicity throughout the process. Gain insights into package versions, bbappend files, BitBake assignment operators, device trees, firmware, and WIC image creation. Understand layer dependencies, compatibility checks, and how to ensure your BSP integrates seamlessly with the Yocto Project ecosystem.
How to Write a Really Good Board Support Package for Yocto Project
Overview
Syllabus
Intro
About Chris Simmonds
Board Support Packages
Setting up the environment
Local configuration
Recipes
Config, layer and recipe
The trinity of OE: Distro, Machine, Image
Three types of layer
What goes into a BSP layer?
Create a layer for your BSP
Bootloader
Digression 1: package versions
Digression 2: bbappend
Kernel 1/2
Digression: BitBake assignment operators
Device trees
Firmware
Image format
Setting the image type
Creating images with WIC
Enabling WIC
Don't break things
Dependencies between layers
Check the layer
Yocto compatibility
Taught by
NDC Conferences
