Overview
Learn about the current state and future direction of the HBM (High Bandwidth Memory) market in this 23-minute conference talk from SK AI SUMMIT 2024. Explore how the AI technology's rapid advancement is shifting the HBM market from training to inference applications, with big tech companies making substantial investments to secure AI chip demand for inference services. Understand the growing preference for customized HBM solutions that maximize compatibility with AI chips for optimal server cost-performance ratios. Discover the importance of rapid customer alignment in base die design and the crucial competitive advantage of establishing strong three-way collaboration models between memory manufacturers (SK hynix), IP/Foundry companies (TSMC), and AI chip customers from early development stages. Gain insights from SK hynix's AI Infra HBM Business Product Organization leader, who leverages extensive experience in DRAM design and product analysis to maintain SK hynix's leadership in the HBM market through swift analysis infrastructure setup and proactive customer engagement.
Syllabus
새 국면에 접어든 HBM 시장에 대한 SK hynix 준비 현황 및 방향 | SK하이닉스 박문필
Taught by
SK AI SUMMIT 2024