An Introduction to Electronics System Packaging

Mod-01 Lec-01 Introduction and Objectives of the course.
Mod-01 Lec-02 Definition of a system and history of semiconductors.
Mod-01 Lec-03 Products and levels of packaging.
Mod-01 Lec-04 Packaging aspects of handheld products; Case studies in applications.
Mod-01 Lec-05 Case Study (continued); Definition of PWB, summary and Questions for review.
Mod-02 Lec-06 Basics of Semiconductor and Process flowchart; Video on "Sand-to-Silicon".
Mod-02 Lec-07 Wafer fabrication, inspection and testing.
Mod-02 Lec-08 Wafer packaging; Packaging evolution; Chip connection choices.
Mod-02 Lec-09 Wire bonding, TAB and flipchip-1.
Mod-02 Lec-10 Wire bonding, TAB and flipchip-2; Tutorials.
Mod-03 Lec-11 Why packaging? & Single chip packages or modules (SCM).
Mod-03 Lec-12 Commonly used packages and advanced packages; Materials in packages.
Mod-03 Lec-13 Advances packages (cont),Thermal mismatch in packages,Current trends in packaging.
Mod-03 Lec-14 Multichip modules (MCM)-types; System-in-package (SIP); Packaging roadmaps.
Mod-04 Lec-15 Electrical Issues -- I; Resistive Parasitic.
Mod-04 Lec-16 Electrical Issues -- II; Capacitive and Inductive Parasitic.
Mod-04 Lec-17 Electrical Issues -- III; Layout guidelines and the Reflection problem.
Mod-04 Lec-18 Electrical Issues -- IV; Interconnection.
Mod-05 Lec-19 Quick Tutorial on packages; Benefits from CAD; Introduction to DFM, DFR & DFT.
Mod-05 Lec-20 Components of a CAD package and its highlights.
Mod-05 Lec-21 Design Flow considerations; Beginning a circuit design with schematic work.
Mod-05 Lec-22 Demo and examples of layout and routing; Technology file generation from CAD;.
Mod-06 Lec-23 Review of CAD output files for PCB fabrication; Photo plotting and mask generation.
Mod-06 Lec-24 Process flow-chart; Vias; PWB substrates.
Mod-06 Lec-25 Substrates continued; Video highlights; Surface preparation.
Mod-06 Lec-26 Photoresist and application methods,UV exposure and developing.
Mod-06 Lec-27 PWB etching; Resist stripping; Screen-printing technology.
Mod-06 Lec-28 Through-hole manufacture process steps; Panel and pattern plating methods.
Mod-06 Lec-29 Video highlights on manufacturing; Solder mask for PWBs; Multilayer PWBs.
Mod-06 Lec-30 Microvia technology and Sequential build-up technology process flow for high-density.
Mod-06 Lec-31 Conventional Vs HDI technologies; Flexible circuits; Tutorial session.
Mod-07 Lec-32 SMD benefits; Design issues; Introduction to soldering.
Mod-07 Lec-33 Reflow and Wave Soldering methods to attach SMDs.
Mod-07 Lec-34 Solders; Wetting of solders; Flux and its properties; Defects in wave soldering.
Mod-07 Lec-35 Vapour phase soldering, BGA soldering and Desoldering/Repair; SMT failures.
Mod-07 Lec-36 SMT failure library and Tin Whiskers.
Mod-07 Lec-37 Tin-lead and lead-free solders,Phase diagrams,Thermal profiles for reflow soldering.
Mod-07 Lec-38 Lead-free solder considerations,green electronics,RoHS compli & e-waste recycling iss.
Mod-08 Lec-39 Thermal Design considerations in systems packaging.
Mod-09 Lec-40 Introduction to embedded passives; Need for embedded passives; Design Library.
Mod-09 Lec-41 Embedded capacitors; Processes for embedding capacitors; Case study examples.
Mod-10 Lec-42 Chapter-wise summary.