Overview

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Instructor: Prof. G. V. Mahesh, Department of Electronic Systems Engineering, IISc Bangalore.

The objective of this course is to sensitize the undergraduate students and graduate students to the all-important multidisciplinary area of electronics systems packaging. The course will discuss all the important facets of packaging at three major levels, namely, chip level, board level and system level. The entire spectrum of microelectronic systems packaging from design to fabrication; assembly and test will be covered. Current trends in packaging of electronic systems will be covered.

Syllabus

Mod-01 Lec-01 Introduction and Objectives of the course.
Mod-01 Lec-02 Definition of a system and history of semiconductors.
Mod-01 Lec-03 Products and levels of packaging.
Mod-01 Lec-04 Packaging aspects of handheld products; Case studies in applications.
Mod-01 Lec-05 Case Study (continued); Definition of PWB, summary and Questions for review.
Mod-02 Lec-06 Basics of Semiconductor and Process flowchart; Video on "Sand-to-Silicon".
Mod-02 Lec-07 Wafer fabrication, inspection and testing.
Mod-02 Lec-08 Wafer packaging; Packaging evolution; Chip connection choices.
Mod-02 Lec-09 Wire bonding, TAB and flipchip-1.
Mod-02 Lec-10 Wire bonding, TAB and flipchip-2; Tutorials.
Mod-03 Lec-11 Why packaging? & Single chip packages or modules (SCM).
Mod-03 Lec-12 Commonly used packages and advanced packages; Materials in packages.
Mod-03 Lec-13 Advances packages (cont),Thermal mismatch in packages,Current trends in packaging.
Mod-03 Lec-14 Multichip modules (MCM)-types; System-in-package (SIP); Packaging roadmaps.
Mod-04 Lec-15 Electrical Issues -- I; Resistive Parasitic.
Mod-04 Lec-16 Electrical Issues -- II; Capacitive and Inductive Parasitic.
Mod-04 Lec-17 Electrical Issues -- III; Layout guidelines and the Reflection problem.
Mod-04 Lec-18 Electrical Issues -- IV; Interconnection.
Mod-05 Lec-19 Quick Tutorial on packages; Benefits from CAD; Introduction to DFM, DFR & DFT.
Mod-05 Lec-20 Components of a CAD package and its highlights.
Mod-05 Lec-21 Design Flow considerations; Beginning a circuit design with schematic work.
Mod-05 Lec-22 Demo and examples of layout and routing; Technology file generation from CAD;.
Mod-06 Lec-23 Review of CAD output files for PCB fabrication; Photo plotting and mask generation.
Mod-06 Lec-24 Process flow-chart; Vias; PWB substrates.
Mod-06 Lec-25 Substrates continued; Video highlights; Surface preparation.
Mod-06 Lec-26 Photoresist and application methods,UV exposure and developing.
Mod-06 Lec-27 PWB etching; Resist stripping; Screen-printing technology.
Mod-06 Lec-28 Through-hole manufacture process steps; Panel and pattern plating methods.
Mod-06 Lec-29 Video highlights on manufacturing; Solder mask for PWBs; Multilayer PWBs.
Mod-06 Lec-30 Microvia technology and Sequential build-up technology process flow for high-density.
Mod-06 Lec-31 Conventional Vs HDI technologies; Flexible circuits; Tutorial session.
Mod-07 Lec-32 SMD benefits; Design issues; Introduction to soldering.
Mod-07 Lec-33 Reflow and Wave Soldering methods to attach SMDs.
Mod-07 Lec-34 Solders; Wetting of solders; Flux and its properties; Defects in wave soldering.
Mod-07 Lec-35 Vapour phase soldering, BGA soldering and Desoldering/Repair; SMT failures.
Mod-07 Lec-36 SMT failure library and Tin Whiskers.
Mod-07 Lec-37 Tin-lead and lead-free solders,Phase diagrams,Thermal profiles for reflow soldering.
Mod-07 Lec-38 Lead-free solder considerations,green electronics,RoHS compli & e-waste recycling iss.
Mod-08 Lec-39 Thermal Design considerations in systems packaging.
Mod-09 Lec-40 Introduction to embedded passives; Need for embedded passives; Design Library.
Mod-09 Lec-41 Embedded capacitors; Processes for embedding capacitors; Case study examples.
Mod-10 Lec-42 Chapter-wise summary.