Breaking the Barrier: Chip Level Cooling Up to and Beyond 1000W in Single Phase Dielectric Fluid
Open Compute Project via YouTube
Overview
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Learn about groundbreaking advancements in data center cooling technology through a 19-minute conference talk by Iceotope Technologies' Vice President Kelley Mullick, who demonstrates how single-phase dielectric fluid cooling can effectively handle chip-level cooling beyond 1000W. Explore how this innovation addresses the increasing cooling demands of dense IT equipment, particularly CPUs and GPUs used in generative AI applications, challenging the previous industry perception that single-phase liquid cooling was limited to 400W at the chip level. Discover the latest testing results that showcase competitive thermal resistance achievements, positioning this technology as a viable solution for the next generation of high-performance computing needs.
Syllabus
Breaking the barrier, chip level cooling up to and beyond 1000W in single phase dielectric fluid
Taught by
Open Compute Project