Power Delivery Challenges for AI Accelerators - Advancements and Development of High Density Solutions

Explore power delivery challenges and solutions for AI accelerators in this technical presentation from AMD experts. Dive into the evolution of power module solutions, specifically focusing on AMD Mi300X's innovative vertical stacking approach that achieves 60% higher density compared to previous generations. Learn about the emerging ecosystem of high-density power solutions, examining component and board-level quality challenges in multi-chip integrated packages. Understand the proposed standardization efforts for improving availability through common design elements including electrical specifications, thermal considerations, sizing, and footprint requirements. Discover future power delivery requirements and the push towards achieving 2A/mm^2 current density for next-generation AI accelerators.