Completed
Etching L21 L4
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Classroom Contents
PCB Manufacturing and Assembly Process - From Raw Materials to Finished Product
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- 1 What is this video about
- 2 Raw material cut to panels
- 3 Cleaning PCB
- 4 Photosensitive film applied Building layers L2 & L3
- 5 Exposing L2, L3
- 6 Developing L2, L3
- 7 Etching L2, L3
- 8 Removing photosensitive layer
- 9 AOI - Automated Optical Inspection
- 10 Making copper rougher
- 11 Adding prepreg
- 12 Adding copper sheets - Top and Bottom layer L1, L4
- 13 Baking PCBs, oven room
- 14 Splitting to two panels again
- 15 Adding aluminum sheet
- 16 Drilling
- 17 Plating
- 18 Electroless plating
- 19 Electroplating
- 20 Applying photosensitive film on L1 and L4
- 21 Exposing L1, L4
- 22 Developing L1, L4
- 23 Applying tin layer
- 24 Removing photosensitive layer from L1, L4
- 25 Etching L21 L4
- 26 Removing tin layer
- 27 AOI - Automated Optical Inspection
- 28 Optional electrical testing
- 29 Adding solder mask color
- 30 Exposing solder mask
- 31 Developing solder mask
- 32 Making silkscreen
- 33 Gold plating
- 34 Optical inspection, fixing, measuring
- 35 Electrical test
- 36 Milling - Removing PCB from big panel
- 37 V-Score
- 38 Packing PCB
- 39 Board Assembly
- 40 Inserting components into feeders
- 41 Stencil & Paste
- 42 Setting up component placement
- 43 Checking placement with AOI
- 44 Soldering - Going to owen
- 45 Checking after soldering
- 46 Assembling a board
- 47 Manual checking
- 48 Fitting through hole components
- 49 Wave soldering
- 50 Conformal coating
- 51 Packing assembled board
- 52 3D printing
- 53 Done. Packing and shipping
