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Acoustic Microscopy: Examining Epoxy Encapsulation
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Classroom Contents
Using Superpowers for Hardware Reverse Engineering
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- 1 Using Superpowers for Hardware Reverse Engineering
- 2 HW Reverse Engineering
- 3 PCB Construction & Layer Stack 2
- 4 Laser: Soldermask Removal 2
- 5 Laser: Controlled-Depth Skiving 2
- 6 Laser: Full PCB Layer Ablation 2
- 7 Acoustic Microscopy: Examining Epoxy Encapsulation
- 8 X-Ray (2D): General PCB Inspection 4
- 9 X-Ray (3D/CT): PCB Layer Extraction
