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IC Market Megatrends...
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Classroom Contents
Signal Integrity Analysis for 2.5D/3D IC Technology in the Interposer Era
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- 1 Intro
- 2 IC Market Megatrends...
- 3 Heterogeneous Design with Silicon Interposers
- 4 3D-IC Engineering Challenges
- 5 SI Challenges for High-Speed Silicon Interposer 2.5D/3D-ICS
- 6 RaptorH: The Die-centric Approach to 2.5D/3D-IC SI Analysis
- 7 RaptorH certification by foundries seals golden reference status
- 8 Analytical modeling of iCAPS (Interposer CAPacitors)
- 9 Case study: HBM channel with dense dummy tiles
- 10 RaptorX vs HFSS: Transmission & Reflection of Net04 and Net12
- 11 RaptorX vs HFSS: Coupling of Net04 and Net12
- 12 Circuit simulation results at termination
- 13 Key Capability: Gold Standard Accuracy, Reliability
- 14 Interposer Design
- 15 HFSS simulation
- 16 Ansys optiSLang: Power of Variation Analysis
- 17 HFSS 3D Layout Parametric Design
- 18 Interposer on Package on PCB Optimization
- 19 Interposer on Package on PCB System results
