3D IC Test Strategy and DFT Methodologies for Advanced Packaging Technologies

3D IC Test Strategy and DFT Methodologies for Advanced Packaging Technologies

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Prober and Handler Selection

18 of 20

18 of 20

Prober and Handler Selection

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3D IC Test Strategy and DFT Methodologies for Advanced Packaging Technologies

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  1. 1 Intro
  2. 2 What Drives the 3D Integration?
  3. 3 Who are the 3D IC Players?
  4. 4 Semiconductor Ecosystem Mapping
  5. 5 Semiconductor Test Players Mapping
  6. 6 OSAT: IC Packaging & Test Turnkey Solution
  7. 7 Test Development & NPI
  8. 8 IC Test Fundamental
  9. 9 IC Test Manufacturing
  10. 10 3D IC Testing
  11. 11 Scan Test
  12. 12 DFT Standards
  13. 13 IEEE 1838 for 3D IC Stack
  14. 14 Boundary Scan Description Language
  15. 15 IJTAG Description Languages
  16. 16 Automatic Test Pattern Generation (ATPG)
  17. 17 ATE Platform Selection
  18. 18 Prober and Handler Selection
  19. 19 3D IC Test Strategy
  20. 20 Takeaway Conclusion

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