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Mod-01 Lec-32 IC circuit logic and packaging
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Classroom Contents
Electronic Materials, Devices, and Fabrication
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- 1 Electronic Materials
- 2 Worked numericals on week 1 lessons
- 3 Optional - worked assignment on intrinsic semiconductors
- 4 Semiconductors: Introduction
- 5 Junction breakdown and heterojunctions
- 6 Electron statistics in a solid
- 7 Worked assignment on extrinsic semiconductors
- 8 Intrinsic semiconductors
- 9 Optional - worked assignment on metal-semiconductor junctions
- 10 Intrinsic semiconductors - conductivity
- 11 Worked assignment on pn junctions
- 12 Extrinsic semiconductors: Introduction
- 13 Worked assignment on transistors
- 14 Extrinsic semiconductors - Fermi level
- 15 Optional - worked assignment on optical properties
- 16 Extrinsic semiconductors - mobility
- 17 Worked assignment on optoelectronic devices
- 18 Metal-semiconductor junctions
- 19 pn junctions in equilibrium
- 20 pn junctions under bias
- 21 Transistors - overview
- 22 MOSFETs
- 23 Optoelectronic devices: Introduction
- 24 Light emitting diodes
- 25 Solid state semiconductor lasers
- 26 Photodetectors
- 27 Solar cells
- 28 Mod-01 Lec-20 Semiconductor manufacturing: Introduction
- 29 Mod-01 Lec-21 Si wafer manufacturing
- 30 Mod-01 Lec-22 IC device manufacturing: overview
- 31 Mod-01 Lec-23 Layering: thermal oxidation
- 32 Mod-01 Lec-24 Doping: thermal and ion implantation
- 33 Mod-01 Lec-25 Lithography
- 34 Mod-01 Lec-26 Etching and deposition (growth)
- 35 Mod-01 Lec-27 Metallization and polishing
- 36 Mod-01 Lec-28 Process and device evaluation
- 37 Mod-01 Lec-29 Productivity and process yield
- 38 Mod-01 Lec-30 Clean room design and contamination control
- 39 Mod-01 Lec-31 Devices and IC formation
- 40 Mod-01 Lec-32 IC circuit logic and packaging
