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Mod-06 Lec-28 Through-hole manufacture process steps; Panel and pattern plating methods
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Classroom Contents
An Introduction to Electronics System Packaging
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- 1 Mod-01 Lec-01 Introduction and Objectives of the course
- 2 Mod-01 Lec-02 Definition of a system and history of semiconductors
- 3 Mod-01 Lec-03 Products and levels of packaging
- 4 Mod-01 Lec-04 Packaging aspects of handheld products; Case studies in applications
- 5 Mod-01 Lec-05 Case Study (continued); Definition of PWB, summary and Questions for review
- 6 Mod-02 Lec-06 Basics of Semiconductor and Process flowchart; Video on "Sand-to-Silicon"
- 7 Mod-02 Lec-07 Wafer fabrication, inspection and testing
- 8 Mod-02 Lec-08 Wafer packaging; Packaging evolution; Chip connection choices
- 9 Mod-02 Lec-09 Wire bonding, TAB and flipchip-1
- 10 Mod-02 Lec-10 Wire bonding, TAB and flipchip-2; Tutorials
- 11 Mod-03 Lec-11 Why packaging? & Single chip packages or modules (SCM)
- 12 Mod-03 Lec-12 Commonly used packages and advanced packages; Materials in packages
- 13 Mod-03 Lec-13 Advances packages (cont),Thermal mismatch in packages,Current trends in packaging
- 14 Mod-03 Lec-14 Multichip modules (MCM)-types; System-in-package (SIP); Packaging roadmaps
- 15 Mod-04 Lec-15 Electrical Issues -- I; Resistive Parasitic
- 16 Mod-04 Lec-16 Electrical Issues -- II; Capacitive and Inductive Parasitic
- 17 Mod-04 Lec-17 Electrical Issues -- III; Layout guidelines and the Reflection problem
- 18 Mod-04 Lec-18 Electrical Issues -- IV; Interconnection
- 19 Mod-05 Lec-19 Quick Tutorial on packages; Benefits from CAD; Introduction to DFM, DFR & DFT
- 20 Mod-05 Lec-20 Components of a CAD package and its highlights
- 21 Mod-05 Lec-21 Design Flow considerations; Beginning a circuit design with schematic work
- 22 Mod-05 Lec-22 Demo and examples of layout and routing; Technology file generation from CAD;
- 23 Mod-06 Lec-23 Review of CAD output files for PCB fabrication; Photo plotting and mask generation
- 24 Mod-06 Lec-24 Process flow-chart; Vias; PWB substrates
- 25 Mod-06 Lec-25 Substrates continued; Video highlights; Surface preparation
- 26 Mod-06 Lec-26 Photoresist and application methods,UV exposure and developing
- 27 Mod-06 Lec-27 PWB etching; Resist stripping; Screen-printing technology
- 28 Mod-06 Lec-28 Through-hole manufacture process steps; Panel and pattern plating methods
- 29 Mod-06 Lec-29 Video highlights on manufacturing; Solder mask for PWBs; Multilayer PWBs
- 30 Mod-06 Lec-30 Microvia technology and Sequential build-up technology process flow for high-density
- 31 Mod-06 Lec-31 Conventional Vs HDI technologies; Flexible circuits; Tutorial session
- 32 Mod-07 Lec-32 SMD benefits; Design issues; Introduction to soldering
- 33 Mod-07 Lec-33 Reflow and Wave Soldering methods to attach SMDs
- 34 Mod-07 Lec-34 Solders; Wetting of solders; Flux and its properties; Defects in wave soldering
- 35 Mod-07 Lec-35 Vapour phase soldering, BGA soldering and Desoldering/Repair; SMT failures
- 36 Mod-07 Lec-36 SMT failure library and Tin Whiskers
- 37 Mod-07 Lec-37 Tin-lead and lead-free solders,Phase diagrams,Thermal profiles for reflow soldering
- 38 Mod-07 Lec-38 Lead-free solder considerations,green electronics,RoHS compli & e-waste recycling iss
- 39 Mod-08 Lec-39 Thermal Design considerations in systems packaging
- 40 Mod-09 Lec-40 Introduction to embedded passives; Need for embedded passives; Design Library
- 41 Mod-09 Lec-41 Embedded capacitors; Processes for embedding capacitors; Case study examples
- 42 Mod-10 Lec-42 Chapter-wise summary
